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GC-SP-SB100 High Thermal Conductivity Electronic Transistor Grey Hole Heat Dissipation Silicone Tape for Filing between The Shell

Thermal Sil-Pad: Enhancing Heat Conduction in Electronic Appliances and Beyond

In today's fast-paced world, electronic appliances have become an integral part of our daily lives. From smartphones to laptops, these devices have revolutionized the way we communicate, work, and entertain ourselves. However, with the increasing complexity and power requirements of these appliances, the issue of heat dissipation has become a significant concern. This is where Thermal Sil-Pad comes into play.

Thermal Sil-Pad is a cloth product that is based on a unique combination of silicon rubber and glass fiber. Through a meticulous manufacturing process, this innovative material is created, boasting exceptional thermal conductivity and insulation properties. Its versatility and convenience make it a popular choice across various industries, particularly in the electronics sector.

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  • GC-SP-SB100

  • Gold-cool

  • ISO9001, ISO14001, UL, Rohs, IATF16949, Reach

When it comes to heat management in electronic appliances, Thermal Sil-Pad proves to be an invaluable asset. Its excellent thermal conductivity ensures efficient heat transfer, preventing the buildup of excessive heat that can potentially damage sensitive components. By acting as a heating conduction medium, it effectively dissipates heat from the fever interface and space of elements, ensuring optimal performance and longevity of electronic devices.

To maximize the benefits of Thermal Sil-Pad, it is crucial to select the appropriate thickness based on the size of the fever interface and the height of the clearance. This allows for a customized fit, ensuring seamless integration and enhanced heat conduction. With a wide range of thickness options available, users can easily find the perfect match for their specific requirements.

The applications of Thermal Sil-Pad extend far beyond electronic appliances. Its exceptional thermal conductivity and insulation properties make it a sought-after solution in various industries. For instance, in the automotive sector, it can be used to improve heat issipation in engine components, ensuring optimal performance and preventing overheating. Similarly, in the aerospace industry, Thermal Sil-Pad can play a crucial role in maintaining the temperature balance of critical electronic systems.


Product Parameters

Project

GC-SP-SB100

Unit

Testing  Standards

Thermal   Conductivity

0.8±0.2

W/m.K

ASTM D5470

Thickness

0.25

0.3

0.45

mm

ASTM D374

Therma Impedance @50Psi

0.7

0.8

1.25

℃*in2/W

ASTM D5470

Color

Yellow/Grey/Brick Red

Hardness

80

Shore A

ASTM D2240

Density

1.6±0.1

g/cm3

ASTM D792

Tensile Strength

≥10

MPa

ASTM D412

Volume Resistivity

≥1.0*1013

Ω.cm

ASTM D257

Flame Rating

V-0

UL 94

Breakdown

Voltage

≥4

KV

ASTM D149

Temperature Range

-40~200




Product features:

● Outstanding insulation performance

● Exceptional mechanical performance

● Good thermal conductivity

● Remarkable flame retardant effect

● Durable and puncture-resistant



Product application:

● Suitable for switch power supply, uninterruptible power supply, and other power supply equipment

● Ideal for communication equipment, mobile devices, and household appliances

● Can be used to fill heat sources, heat dissipation modules, or housings

● Provides insulation between charged heating elements and housings



Product configuration:

● Dimensions can be customized to meet specific requirements

● Can be tailored to match desired color preferences

● Tape specifications can be specified as needed

Roll length: 0.3mm*50m / 0.3mm*100m


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Dongguan Gold-cool nano technology co.LTD,it is a high-tech enterprise integrating research,development,production and sales in the field of heat conducting.
  +86-15338359308
    2nd Floor, Building 1, Aierpu Industrial Zone, Xinxing Road, Wuxing Shanghu Village, Xiegang Town, Dongguan City, GuangDong Province, China

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Please contact us with any questions you may have by filling out and sending the form below.

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Fileds marked with an * are required to complete this request.

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