Heat conduction material, also known as heat conduction material, is a new type of material widely used at present, which is different from the traditional cognitive materials, such as plastic materials, metal materials, etc. at present, the research and development of heat conduction materials is very hot, generally these are national high-tech industries.

 

So why do you need heat conducting materials?

 

With the development of the times, the current products are getting smaller and smaller. Mobile phones are the most popular in the 1990s. Now mobile phones have more and more functions and speed, which requires a powerful chip. The chip cooling depends on heat-conducting materials. At present, the computer, mobile phones, aircraft, communication, electric vehicles, led, medical devices and other industries have a very large demand for heat-conducting materials, which also promotes The development of the industry.

 

There are many kinds of thermal conductive materials, such as thermal conductive silica gel, thermal conductive silicone grease, thermal conductive gasket, heat conducting gel, heat conducting mud, heat conductive silica gel sleeve, graphite sheet and so on.

 

Dongguan Gold-cool Nano Technology Co., Ltd. in the new thermal conductive material industry, integrates design, R & D, generation, sales and service, providing one-stop solutions for customer service.

Heat conductive silica gel is a kind of potting adhesive which can be solidified at room temperature. The biggest difference between heat conductive silica gel and heat conductive silicone grease is that heat conductive silica gel can be solidified and has certain bonding performance.

 

Heat conducting silica gel is generally used on the surface of some electronic parts and chips with small heat output. The thermal conductive silica gel sheet has very good thermal conductivity and filling property. Its own softness can fill the gap between the heating element and the heat dissipation module, the metal mechanism and the shell, quickly dissipate the heat energy, improve the working efficiency of the element, and achieve the purpose of prolonging the service life of the equipment.

 

Thermal silicone grease is a kind of material used to fill the gap between CPU and heat sink. Its function is to transmit heat from CPU to heat sink, keep CPU temperature at a stable working level, prevent CPU from damage due to poor heat dissipation, and extend service life.

 

In the application of heat dissipation and heat conduction, even the two surfaces with very smooth surface will have gaps when contacting each other. The air in these gaps is a bad conductor of heat, which will hinder the heat conduction to the heat sink. Thermal conductive silicone grease is a kind of material that can fill these gaps and make the heat conduction more smooth and rapid.

 

Now there are many types of silicone grease on the market. Different parameters and physical properties determine different uses. Some are suitable for heat conduction of CPU, some are suitable for heat conduction of memory, some are suitable for heat conduction of power supply, some are electronic products, heat dissipation of power supply, fast temperature measurement of sensor, etc. The working temperature of thermal conductive silicone grease is generally not more than 200 ℃, the high temperature can reach 300 ℃, and the low temperature is generally about - 60 ℃.

 

Thermal conductive silicone grease is a kind of high thermal conductive and insulating silicone material, which is almost never solidified. It can be used in the temperature of - 50 ℃ - + 230 ℃ for a long time. It not only has excellent electrical insulation, but also has excellent thermal conductivity. At the same time, it has low oil separation (tends to zero), high and low temperature resistance, water resistance, ozone resistance and weather aging resistance. It can be widely applied to the contact surface between the heating body (power tube, thyristor, electric heating reactor, etc.) and the heat dissipation facilities (heat sink, heat strip, shell, etc.) in various electronic products and electrical equipment, playing the role of heat transfer medium and the performance of moisture-proof, dust-proof, corrosion-proof and shock proof. It is suitable for surface coating or overall sealing of various microwave devices such as microwave communication, microwave transmission equipment, microwave special power supply, stabilized voltage power supply, etc. this kind of silicon material provides excellent heat conduction effect for the electronic components generating heat. For example: transistor, CPU assembly, thermistor, temperature sensor, automobile electronic parts, automobile refrigerator, power module, printer head, etc.

Thermal conductive silica gel sheet "is a kind of thermal conductive medium material synthesized by special process with silica gel as the base material, adding various auxiliary materials such as metal oxide, etc. in the industry, it is also called thermal conductive silica gel pad, thermal conductive silica film, soft thermal conductive pad, thermal conductive silica gel pad, etc. it is specially designed and produced for the use of gap to transfer heat. It can fill the gap, complete the heating part and heat dissipation The heat transfer between parts can also play the role of insulation, shock absorption, sealing, etc., which can meet the design requirements of miniaturization and ultrathin of equipment. It is a kind of excellent heat conduction filling material with high technology and usability, wide range of thickness application.

 

 

Advantages of thermal conductive silicon film:

 

1. Soft material, good compression performance, good thermal insulation performance, large adjustable thickness range, suitable for filling cavity, natural viscosity on both sides, strong operability and maintainability;

 

2. The main purpose of selecting thermal conductive silicon film is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator, and the thermal conductive silicon film can fill the gap between the contact surfaces well;

 

3. Because air is a bad conductor of heat, it will seriously hinder the heat transfer between the contact surfaces, and the air can be extruded out of the contact surface by adding a heat conducting silica gel sheet between the heat source and the radiator;

 

4. With the supplement of thermal conductive silicon film, the contact surface between the heat source and the radiator can be fully and better contacted, so as to achieve face-to-face contact. The reaction at temperature can reach the minimum temperature difference;

 

5. The thermal conductivity of the thermal conductive silicon film is adjustable and its thermal stability is better;

 

6. The process difference of heat conduction silica gel sheet in structure is closed, which reduces the process difference requirements of radiator and heat dissipation structure;

 

7. The conductive silica gel sheet has the insulating property;

 

8. The heat conducting silica gel sheet has the effect of shock absorption and sound absorption;

 

9. The thermal conductive silica gel sheet has the convenience of installation, test and reuse.
 

 

Application field of thermal conductive silicon film

 

1. LED industry use

The thermal conductive silicon film is used between the aluminum substrate and the heat sink; the thermal conductive silicon film is used between the aluminum substrate and the shell.

 

2. Home appliance industry

Microwave oven / air conditioner (between fan motor power IC and shell) / electromagnetic oven (between thermistor and radiator).

 

3. Application of PDP / LED TV

Power IC, heat conduction between image decoder IC and radiator (shell).

 

4. Automotive electronics industry applications

Such as xenon lamp ballast, audio, car series products, etc., can be used to heat conductive silica gel sheet

 

5. Communication industry

Heat conduction and heat dissipation between the DC-DC IC of set top box and the shell.

Characteristics and application of various types of thermal conductive materials: The compression resilience of thermal conductive silicone sheets has good thermal conductivity and high level of withstand voltage, which meets the demand for thermal conductive materials in the electronic industry. It is an alternative to thermal grease and thermal mica plus mica. The best product for the yuan cooling system. Under the same conditions, the thermal impedance is smaller than other thermal materials. With soft, clean, non-polluting and radioactive, high insulation properties, glass fiber reinforcement provides good mechanical properties, can prevent puncture, shear resistance, tear resistance, and can be equipped with thermal pressure sensitive adhesive. This type of thermal conductive film product is easy to install and facilitates automated production and product maintenance. It is a new material with great process and practicality. Flexible thermal silica gel pad A thick thermal conductive gasket specially designed for the transmission of heat through the gap. It can fill the gap and complete the heat transfer between the heat generating part and the heat radiating part, and at the same time, it can also absorb, insulate and seal. It can meet the design requirements of miniaturization and ultra-thinness of equipment.

 

The thermal conductivity of the thermal conductive silicone sheet is not only related to the thickness of the thermal conductive material, but also related to the application area of the thermal conductive material. Due to the structural relationship of the thermally conductive material, in general, the thermally conductive material is also related to the magnitude of the pressure applied. The pressure is high and the thermal conductivity will be strong. Typically, thermal materials are subjected to pressures between 5 and 100 psi, and most radiators do not exceed 250 psi. Alumina thermal conductive rubber: good thermal conductivity, beautiful appearance, widely used in the heat dissipation of communications and other products. Boron nitride thermal conductive rubber: excellent thermal conductivity, suitable for high-power device heat dissipation, under the same conditions, compared with ordinary thermal conductive materials, the device temperature can be lower than 20 °C. Application Note: The above several types of thermal insulation materials are made of silicone rubber. When applying, the heat dissipation surface should be smooth and clean, and there should be no burrs to avoid puncturing the rubber sheet and destroying the insulation. The smaller the thermal resistance of the thermally conductive material, the shorter the entry stability time and the lower the stable temperature. The application of the thermal insulation sheet is not necessarily supplemented by other materials.

 

The thermal conductive silicone adhesive can also be used as a thermal conductive adhesive, which not only has the effect of heat conduction, but also is a good material for bonding and sealing potting. The heat of the heat-generating component is conducted by filling the contact surface or the can body. Thermally conductive and insulating potting compound is suitable for potting of electronic components with high heat dissipation requirements. The adhesive has good thermal conductivity after curing, excellent insulation, excellent electrical properties, good adhesion and good gloss.

 

Thermally conductive phase change materials are primarily used in high performance microprocessors and heat generating components that require very low thermal resistance to ensure good heat dissipation. The thermally conductive phase change material undergoes a phase change at about 45 to 50 °C. And under the action of pressure, it flows into and fills the irregular gap between the heating element and the radiator, and squeezes out the air to form a good heat conduction interface.

 

Applications: Microprocessors, memory modules and cache chip DC/DC converters, IGBTs and other power modules Power semiconductor devices, solid state relays, bridge rectifier phase change pads are packaged in rolls and are 100 feet long. The standard width is 25.4 mm and is available in a variety of sizes.

 

Gold-cool.com is a company dedicated to the development, production and sales of high-efficiency thermal conductive materials, thermal conductive silicone sheets, thermal grease, thermal potting adhesive, thermal double-sided tape, thermal plastic, thermal paste, thermal double Face tape, thermal paste, thermal silicone cloth, thermal silicone cap, etc. We can develop customized, economical, and cost-effective thermal materials according to customer needs, and have been used by many world-renowned manufacturers. Welcome new and old customers to call us for information about our products.

Thermal silica gel sheets have a variety of excellent properties and are widely used in heat conduction and heat dissipation of electronic components. According to common application requirements, Gold-cool.com sums up the characteristics of thermal silica gel sheets.

 

Characteristic one, convenience

 

The thermal silica gel sheet is convenient and quick to test and install, and can be reused. Good convenience reduces production processes and corresponding costs, and makes repairs such as repairs faster.

 

Characteristic two, high thermal conductivity

 

The use of the thermal conductive silicone sheet is well filled with the gap between the heat generating component and the heat sink, which greatly improves the heat dissipation and heat dissipation efficiency, and reduces the temperature difference between the interfaces to a low level.

 

Characteristic three, stable

 

The thermal conductive silica gel sheet has good stability and can maintain good characteristics under various environmental conditions, thereby ensuring the stability of the electronic product in various environments.

 

Characteristic four, insulation

 

In the heat conduction and heat dissipation of electronic products, many devices require thermal insulation materials to have insulation properties to prevent electrical conduction from adversely affecting other devices.

 

Characteristic five, sound absorption and shock absorption

 

The thermal conductive silica gel sheet also has a certain sound absorption and shock absorption effect, which makes the performance of the electronic product better, and also plays a certain protective role for each component.

 

The five characteristics of the thermal silica film have made it widely used. It belongs to a relatively mature thermal conductive material. With the advancement of technology, the thermal conductive silicone sheet will have more excellent characteristics, thus further satisfying the actual production application requirements.

As a kind of common thermal conductive material, thermal pad has many types and wide applications. There are many factors to consider when choosing an application. Therefore, it is necessary to develop a suitable and perfect thermal pad selection application program to better adapt to production and application. demand.

 

Based on years of experience in the field of electronic thermal conductivity, Gold-cool.com has summarized the basic steps and solutions for the selection of thermal pad applications, including:

 

1. Formulation of thermal conductivity scheme

 

At present, the heat conduction form of electronic products mainly includes two kinds of traditional heat conduction sheets and structural heat conduction parts, and according to the characteristics of the products, a heat conduction form with high cost performance and high operability is selected.

 

If the thermal conductive sheet is used for heat conduction, it is not suitable to use a thermal conductive tape with a low thermal conductivity, and the thermal conductivity silicone grease with high thermal conductivity is not suitable because it does not have anti-seismic properties. It is recommended to use a metal hook or plastic with a thermal pad for heat conduction, which is better.

 

When using structural heat-conducting parts, it is necessary to consider the structural form of the structural parts at the contact surface, local avoidance, etc. The size of the selected thermal pad and the structural process should be balanced, and the thinner thermal pad should be selected as much as possible. In actual production, in order to operate Further simplification, generally one-sided adhesive is used for bonding, and factors such as component position and package form need to be comprehensively considered.

 

Based on the above factors and precautions, develop a suitable product thermal conductivity plan.

 

2, the choice of thermal materials

 

After the thermal conductivity scheme is formulated, it is necessary to select the thermal pad to be used, mainly considering thermal conductivity, size and thickness.

 

Depending on the application location, a thermal pad with a suitable thermal conductivity, such as a chip that is sensitive to temperature and has a relatively high heat flux density, requires a thermal silica film with a high thermal conductivity to meet the heat dissipation requirements.

 

The size of the thermal pad should be based on the heat source. The use of a large thermal pad does not improve the thermal conductivity. In addition, the thickness of the thermal pad is related to the hardness, density, compression ratio, etc. The specific thickness can be based on actual test results. determine.

 

Relative to the above factors, other factors such as volume resistance, surface resistance, dielectric constant, and breakdown voltage are not required when selecting, and the basic requirements can be met.

 

In short, the development of thermal pad selection application plans to consider the thermal conductivity requirements, material costs, production processes and other aspects, and requires the developers to have a wealth of industry experience. For more information on thermal pad selection and application, please contact customer service at gold-cool.com. Gold-cool.com has many years of experience in the field of electronic thermal conductivity, because of the focus, so professional!