Chip thermal putty is designed to fill gaps and irregularities between heat-generating components and heat sinks, eliminating air pockets and hotspots. By promoting efficient heat dissipation, it helps maintain safe operating temperatures, prolonging the lifespan and performance of your devices.
With its excellent thermal conductivity, stable thermal putty effectively transfers heat from the source to the heat sink, minimizing thermal resistance and improving overall cooling efficiency. Its soft and flexible texture ensures excellent conformability, allowing for easy application and reworkability.