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GC-TP-150A
Gold-cool
ISO9001
In the realm of cooling devices, ensuring a proper fit between electronic components and the cooling apparatus is of utmost importance. Failure to achieve a seamless connection can result in a significant hindrance to heat transmission between the components, rendering the cooling device ineffective in its primary task of reducing the heat generated by the electronic elements.
To address this critical issue, a range of products has emerged with exceptional thermal conductivity and filling properties. These products possess remarkable softness and elasticity, enabling them to effectively bridge the gaps between heating components and heat dissipation modules. Moreover, they prove invaluable in filling the voids between the metal body and chassis, facilitating rapid heat dissipation. By doing so, these products play a pivotal role in enhancing the operational efficiency of the components while simultaneously prolonging the lifespan of the equipment.
Detailed Photos
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |
In the realm of cooling devices, ensuring a proper fit between electronic components and the cooling apparatus is of utmost importance. Failure to achieve a seamless connection can result in a significant hindrance to heat transmission between the components, rendering the cooling device ineffective in its primary task of reducing the heat generated by the electronic elements.
To address this critical issue, a range of products has emerged with exceptional thermal conductivity and filling properties. These products possess remarkable softness and elasticity, enabling them to effectively bridge the gaps between heating components and heat dissipation modules. Moreover, they prove invaluable in filling the voids between the metal body and chassis, facilitating rapid heat dissipation. By doing so, these products play a pivotal role in enhancing the operational efficiency of the components while simultaneously prolonging the lifespan of the equipment.
Detailed Photos
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |