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GC-TP-150E3
Gold-cool
ISO9001, ISO14001, UL, Rohs, IATF16949, Reach
The enhanced heat dissipation provided by thermal pads contributes to improved productivity. Excessive heat can lead to thermal throttling, a phenomenon where the performance of electronic components is automatically reduced to prevent overheating. By maintaining optimal temperatures, thermal pads prevent thermal throttling, allowing the components to operate at their full potential. This results in faster processing speeds, smoother multitasking, and overall improved efficiency.
Features:
1. Excellent heat efficiency.
2. Flexible and highly absorbent to vibrations and shocks.
3. Adheres easily.
4. Simple to install.
5. Insulates against electricity.
6. Meets environmental standards like ROHS and UL.
7. Offers a range of thickness options.
Application:
Microprocessors, central processing units, graphics chips, capacitors for power electronics, crystal components. LED lights, power module, server, hard drive. Plasma screens, LCD monitors, tablets, desktop PCs, communication devices, routers. Memory modules, media players, smartphones.
We have the ability to tailor thermal conductivity, shape, and size to match the needs of various devices and application situations. If you require a specific hardness for the silicone pad or a particular shape and size, we can offer a suitable solution.
Detailed Photos
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |
The enhanced heat dissipation provided by thermal pads contributes to improved productivity. Excessive heat can lead to thermal throttling, a phenomenon where the performance of electronic components is automatically reduced to prevent overheating. By maintaining optimal temperatures, thermal pads prevent thermal throttling, allowing the components to operate at their full potential. This results in faster processing speeds, smoother multitasking, and overall improved efficiency.
Features:
1. Excellent heat efficiency.
2. Flexible and highly absorbent to vibrations and shocks.
3. Adheres easily.
4. Simple to install.
5. Insulates against electricity.
6. Meets environmental standards like ROHS and UL.
7. Offers a range of thickness options.
Application:
Microprocessors, central processing units, graphics chips, capacitors for power electronics, crystal components. LED lights, power module, server, hard drive. Plasma screens, LCD monitors, tablets, desktop PCs, communication devices, routers. Memory modules, media players, smartphones.
We have the ability to tailor thermal conductivity, shape, and size to match the needs of various devices and application situations. If you require a specific hardness for the silicone pad or a particular shape and size, we can offer a suitable solution.
Detailed Photos
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |