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GC-TP-150E3 High Puncture Resistance Thermal Pad for Electronic Products

Regardless of the type of cooling device used, if there is a mismatch between electronic components and cooling devices, there will be a significant reduction in heat transfer between the components. As a result, the cooling device will not be able to efficiently reduce the heat generated by the electronic components.

These products in the series exhibit excellent thermal conductivity and filling properties. Their softness and elasticity allow them to effectively fill the gaps between the heating component and the heat dissipation module, as well as the gaps between the metal body and chassis. This ensures fast heat dissipation, enhances the efficiency of the components, and prolongs the lifespan of the equipment.
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  • GC-TP-150E3

  • Gold-cool

  • ISO9001, ISO14001, UL, Rohs, IATF16949, Reach

The enhanced heat dissipation provided by thermal pads contributes to improved productivity. Excessive heat can lead to thermal throttling, a phenomenon where the performance of electronic components is automatically reduced to prevent overheating. By maintaining optimal temperatures, thermal pads prevent thermal throttling, allowing the components to operate at their full potential. This results in faster processing speeds, smoother multitasking, and overall improved efficiency.

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Features:

1. Excellent heat efficiency.

2. Flexible and highly absorbent to vibrations and shocks.

3. Adheres easily.

4. Simple to install.

5. Insulates against electricity.

6. Meets environmental standards like ROHS and UL.

7. Offers a range of thickness options.


Application:

Microprocessors, central processing units, graphics chips, capacitors for power electronics, crystal components. LED lights, power module, server, hard drive. Plasma screens, LCD monitors, tablets, desktop PCs, communication devices, routers. Memory modules, media players, smartphones.


We have the ability to tailor thermal conductivity, shape, and size to match the needs of various devices and application situations. If you require a specific hardness for the silicone pad or a particular shape and size, we can offer a suitable solution.

Detailed Photos

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Product Parameters

General Product Attribute Table
Color - White+Yellow Visual
Project Unit GC-TP-100E GC-TP-150E2 Testing Standard
Hardess Shore oo 40±5 27±5 ASTM D2240
Thickness mm 0.5~50
ASTM D374
Density g/cm3 2±0.2 2.1±0.2 ASTM D792
Thermal Conductive W/m.k 1±0.2 1.5±0.2 ASTM D5470
Size mm Customizable -
Thermogravimetric Loss % <1.0 @150ºC/24H
Tensile Strength MPa 0.08-0.32 ASTM D412
Volume Resistivity Ω.cm 1.0*1013 ASTM D257
Dielectric Strength KV/mm >6 ASTM D149
Flame Rating - V-0 UL94
Temperature Range ºC -40~200 -






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Dongguan Gold-cool nano technology co.LTD,it is a high-tech enterprise integrating research,development,production and sales in the field of heat conducting.
  +86-15338359308
    2nd Floor, Building 1, Aierpu Industrial Zone, Xinxing Road, Wuxing Shanghu Village, Xiegang Town, Dongguan City, GuangDong Province, China

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