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GC-TP-300A
Gold-cool
ISO9001, ISO14001, UL, Rohs, IATF16949, Reach
The significance of achieving a seamless fit between electronic components and cooling devices cannot be overstated. When electronic components generate heat during operation, it is imperative to swiftly dissipate this heat to prevent any adverse effects on their performance. However, without a proper connection, the heat transfer process becomes impeded, leading to a buildup of heat within the system. This accumulation of heat can result in a myriad of issues, ranging from decreased performance to irreversible damage to the electronic components. Fortunately, the introduction of these highly efficient thermal pads has revolutionized the cooling industry. With their exceptional thermal conductivity, these pads act as conduits for heat, efficiently transferring it away from the electronic components. Additionally, their unique filling properties allow them to seamlessly fill any gaps or irregularities between the components and the heat dissipation modules. This ensures that heat is not trapped within the system, but rather swiftly dissipated, thereby preventing any detrimental effects on the performance and longevity of the electronic equipment.
Detailed Photos
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |
The significance of achieving a seamless fit between electronic components and cooling devices cannot be overstated. When electronic components generate heat during operation, it is imperative to swiftly dissipate this heat to prevent any adverse effects on their performance. However, without a proper connection, the heat transfer process becomes impeded, leading to a buildup of heat within the system. This accumulation of heat can result in a myriad of issues, ranging from decreased performance to irreversible damage to the electronic components. Fortunately, the introduction of these highly efficient thermal pads has revolutionized the cooling industry. With their exceptional thermal conductivity, these pads act as conduits for heat, efficiently transferring it away from the electronic components. Additionally, their unique filling properties allow them to seamlessly fill any gaps or irregularities between the components and the heat dissipation modules. This ensures that heat is not trapped within the system, but rather swiftly dissipated, thereby preventing any detrimental effects on the performance and longevity of the electronic equipment.
Detailed Photos
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |