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GC-TP-300A High Temperature Resistant Thermal Pad for Integrated Circuit

The importance of achieving a seamless match between electronic parts and cooling devices cannot be emphasized enough. When electronic parts produce heat while operating, it is crucial to quickly dissipate this heat to avoid any negative impact on their performance. However, without a proper connection, the heat transfer process becomes hindered, causing heat to build up within the system. This accumulation of heat can lead to various problems, ranging from reduced performance to irreversible damage to the electronic parts. Luckily, the introduction of these highly effective thermal pads has completely transformed the cooling industry. With their outstanding ability to conduct heat, these pads serve as pathways for heat, effectively transferring it away from the electronic parts.
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  • GC-TP-300A

  • Gold-cool

  • ISO9001, ISO14001, UL, Rohs, IATF16949, Reach

The significance of achieving a seamless fit between electronic components and cooling devices cannot be overstated. When electronic components generate heat during operation, it is imperative to swiftly dissipate this heat to prevent any adverse effects on their performance. However, without a proper connection, the heat transfer process becomes impeded, leading to a buildup of heat within the system. This accumulation of heat can result in a myriad of issues, ranging from decreased performance to irreversible damage to the electronic components. Fortunately, the introduction of these highly efficient thermal pads has revolutionized the cooling industry. With their exceptional thermal conductivity, these pads act as conduits for heat, efficiently transferring it away from the electronic components. Additionally, their unique filling properties allow them to seamlessly fill any gaps or irregularities between the components and the heat dissipation modules. This ensures that heat is not trapped within the system, but rather swiftly dissipated, thereby preventing any detrimental effects on the performance and longevity of the electronic equipment.

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1.Good thermal performance.
2.Soft and high compressibility, vibration shock absorber.
3.Self-adhesive.
4.Easy construction.
5.Electrical insulation
6.Complies ROHS and UL environmental requirements.
7.Provide a variety of thickness to choose.


Application:
Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone


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In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
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Product Parameters

General Product Attribute Table
Color - White+Yellow Visual
Project Unit GC-TP-100E GC-TP-150E2 Testing Standard
Hardess Shore oo 40±5 27±5 ASTM D2240
Thickness mm 0.5~50
ASTM D374
Density g/cm3 2±0.2 2.1±0.2 ASTM D792
Thermal Conductive W/m.k 1±0.2 1.5±0.2 ASTM D5470
Size mm Customizable -
Thermogravimetric Loss % <1.0 @150ºC/24H
Tensile Strength MPa 0.08-0.32 ASTM D412
Volume Resistivity Ω.cm 1.0*1013 ASTM D257
Dielectric Strength KV/mm >6 ASTM D149
Flame Rating - V-0 UL94
Temperature Range ºC -40~200 -



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Dongguan Gold-cool nano technology co.LTD,it is a high-tech enterprise integrating research,development,production and sales in the field of heat conducting.
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