Heat-Conducting Self-Adhesive Silicone Thermal Pad Can Be Customized
No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components. This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis , fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment.
To effectively reduce heat and maintain the high efficiency of electronic components, it is crucial to ensure a proper fit between the cooling device and the heating component. Poor thermal conduction due to a mismatched fit can cause significant heat buildup and affect the performance of the equipment.
The products in this series possess excellent thermal conductivity and filling properties, enabling them to effectively fill gaps between the heating component and the heat dissipation module. The soft and elastic material of the product also allows for efficient heat dissipation, ensuring the optimal performance of electronic components.
Features
1.Good thermal performance. 2.Soft and high compressibility, vibration shock absorber. 3.Self-adhesive. 4.Easy construction. 5.Electrical insulation 6.Complies ROHS and UL environmental requirements. 7.Provide a variety of thickness to choose.
Application: Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
Detailed Photos
Product Parameters
General Product Attribute Table
Color
-
Blue
Light blue+Yellow
Visual
Project
Unit
GC-TP-150A
GC-TP-200A6
GC-TP-200A
GC-TP-200E6
Testing Standard
Hardess
Shore oo
40±5
25±5
45/55 ±5
25±5
ASTM D2240
Thickness
mm
0.5~50
0.5~50
ASTM D374
Density
g/cm3
2.1±0.2
2.4±0.2
2.4±0.2
ASTM D792
Thermal Conductive
W/m.k
1.5±0.2
2±0.2
2.0±0.2
ASTM D5470
Size
mm
Customizable
-
Thermogravimetric Loss
%
<1.0
@150ºC/24H
Tensile Strength
MPa
0.08-0.32
ASTM D412
Volume Resistivity
Ω.cm
1.0*1013
ASTM D257
Dielectric Strength
KV/mm
>6
ASTM D149
Flame Rating
-
V-0
UL94
Temperature Range
ºC
-40~200
-
To effectively reduce heat and maintain the high efficiency of electronic components, it is crucial to ensure a proper fit between the cooling device and the heating component. Poor thermal conduction due to a mismatched fit can cause significant heat buildup and affect the performance of the equipment.
The products in this series possess excellent thermal conductivity and filling properties, enabling them to effectively fill gaps between the heating component and the heat dissipation module. The soft and elastic material of the product also allows for efficient heat dissipation, ensuring the optimal performance of electronic components.
Features
1.Good thermal performance. 2.Soft and high compressibility, vibration shock absorber. 3.Self-adhesive. 4.Easy construction. 5.Electrical insulation 6.Complies ROHS and UL environmental requirements. 7.Provide a variety of thickness to choose.
Application: Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
Detailed Photos
Product Parameters
General Product Attribute Table
Color
-
Blue
Light blue+Yellow
Visual
Project
Unit
GC-TP-150A
GC-TP-200A6
GC-TP-200A
GC-TP-200E6
Testing Standard
Hardess
Shore oo
40±5
25±5
45/55 ±5
25±5
ASTM D2240
Thickness
mm
0.5~50
0.5~50
ASTM D374
Density
g/cm3
2.1±0.2
2.4±0.2
2.4±0.2
ASTM D792
Thermal Conductive
W/m.k
1.5±0.2
2±0.2
2.0±0.2
ASTM D5470
Size
mm
Customizable
-
Thermogravimetric Loss
%
<1.0
@150ºC/24H
Tensile Strength
MPa
0.08-0.32
ASTM D412
Volume Resistivity
Ω.cm
1.0*1013
ASTM D257
Dielectric Strength
KV/mm
>6
ASTM D149
Flame Rating
-
V-0
UL94
Temperature Range
ºC
-40~200
-
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Dongguan Gold-cool nano technology co.LTD,it is a high-tech enterprise integrating research,development,production and sales in the field of heat conducting.
