No matter use what kind of cooling device, if there is a poor fit between electronic components and cooling devices, it will have a lot of air block heat transmission between components. The cooling device will not be able to effectively reduce the heat of electronic components.
This series of products have very good thermal conductivity and filling properties, its softness, elastic characteristics can fill the gap well between heating component and the heat dissipation module, the gap between the metal body and chassis, fast heat dissipation, to promote the work efficiency of components, to extend the service life of equipment.
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GC-TP-300A
Gold-cool
To optimize the performance of electronic components and ensure optimal energy efficiency, it is crucial to select a cooling device that has a proper fit. A poorly matched fit can lead to inefficient heat transfer and reduce the overall efficiency of the equipment.
The products in this series have been engineered with excellent thermal conductivity and filling properties, ensuring that they can effectively fill gaps between the heating component and the heat dissipation module. This provides fast and efficient heat dissipation, enabling the components to work at their optimal level.
Application:
Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
To optimize the performance of electronic components and ensure optimal energy efficiency, it is crucial to select a cooling device that has a proper fit. A poorly matched fit can lead to inefficient heat transfer and reduce the overall efficiency of the equipment.
The products in this series have been engineered with excellent thermal conductivity and filling properties, ensuring that they can effectively fill gaps between the heating component and the heat dissipation module. This provides fast and efficient heat dissipation, enabling the components to work at their optimal level.
Application:
Integrated circuits, CPU, graphics processing chip, power electronic capacitors, crystal.Diode lights,power supply module, server, the hard disk.Plasma displays, LCD monitor, tablet computers,desktop computers, communications equipment, router.Memory module, video player, smart phone
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
