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GC-TP-100E
Gold-cool
When selecting a cooling device for electronic components, it is important to consider the compatibility between the two. A poor fit between the cooling device and the components can result in inefficient heat transfer, leading to heat buildup and reduced efficiency.
This series of products has been designed to provide a seamless fit between the cooling device and the heating component, ensuring efficient heat dissipation and maintaining high performance levels. The soft and flexible nature of the product also makes it easy to install, ensuring a hassle-free cooling solution for electronic equipment.
Features
Detailed Photos
In terms of thermal conductivity, shape, and size, we can customize according to customers' needs to meet the requirements of different devices and application scenarios. Whether you wish for a specific hardness of the silicone pad, or need a silicone pad of a particular shape and size, we have the capability to provide you with a fitting solution.
Product Parameters
General Product Attribute Table | ||||
Color | - | White+Yellow | Visual | |
Project | Unit | GC-TP-100E | GC-TP-150E2 | Testing Standard |
Hardess | Shore oo | 40±5 | 27±5 | ASTM D2240 |
Thickness | mm | 0.5~50 | ASTM D374 | |
Density | g/cm3 | 2±0.2 | 2.1±0.2 | ASTM D792 |
Thermal Conductive | W/m.k | 1±0.2 | 1.5±0.2 | ASTM D5470 |
Size | mm | Customizable | - | |
Thermogravimetric Loss | % | <1.0 | @150ºC/24H | |
Tensile Strength | MPa | 0.08-0.32 | ASTM D412 | |
Volume Resistivity | Ω.cm | 1.0*1013 | ASTM D257 | |
Dielectric Strength | KV/mm | >6 | ASTM D149 | |
Flame Rating | - | V-0 | UL94 | |
Temperature Range | ºC | -40~200 | - |