the superhero of thermal conductivity!
Are you tired of your electronic gadgets overheating like a hot potato? Say goodbye to those scorching moments and say hello to our incredible Thermal gap filler Gel!
This little wonder is here to satisfy all your high compression modulus needs while making your life easier with its automation capabilities. It's like having a personal assistant for your products!
But wait, there's more! Our Thermal gap filler Gel also knows how to make excellent contact with electronic components during assembly. It's like a match made in tech heaven!
Not only that, this gel is a pro at reducing thermal resistance and providing outstanding electrical insulation. It's like having a superhero cape that protects your precious devices from any electrical mishaps! ⚡
So, if you're tired of your gadgets acting like hot-headed divas, it's time to bring in the Thermal gap filler Gel and let it work its magic. Trust us, your devices will thank you later!
| Quantity: | |
|---|---|
GC-GL150
Gold-cool
Project | GC-GL150 | Unit | Testing Standards |
Thermal Conductivity | 1.5 | W/m.K | ASTM D5470 |
Rate of Extrusion | 25 | g/min | 30cc , 90psi |
Color | White | — | — |
Density | 2.1 | g/cm3 | ASTM D792 |
Volume Resistivity | ≥1*1013 | Ω.cm | ASTM D257 |
Temperature Range | -40～180 | ℃ | — |
Flame Rating | V-0 | — | UL94 |
Thermal Weight Loss | ＜1.0 | ％ | @150℃ 240h |
Storage Life | 12 | Month | — |
Product Features:
● Automation point glue , In situ molding
● Excellent insulation performance, Aging resistance
● High and low temperature resistance, vibration absorption and noise reduction
● Low compression stress, and high thermal conductivity
Product Application:
● Memory module, the processor
● Power supply module, integrated chip
● LED lamps, Fever device
Product configuration:
● Bottle 5000g /piece
Project | GC-GL150 | Unit | Testing Standards |
Thermal Conductivity | 1.5 | W/m.K | ASTM D5470 |
Rate of Extrusion | 25 | g/min | 30cc , 90psi |
Color | White | — | — |
Density | 2.1 | g/cm3 | ASTM D792 |
Volume Resistivity | ≥1*1013 | Ω.cm | ASTM D257 |
Temperature Range | -40～180 | ℃ | — |
Flame Rating | V-0 | — | UL94 |
Thermal Weight Loss | ＜1.0 | ％ | @150℃ 240h |
Storage Life | 12 | Month | — |
Product Features:
● Automation point glue , In situ molding
● Excellent insulation performance, Aging resistance
● High and low temperature resistance, vibration absorption and noise reduction
● Low compression stress, and high thermal conductivity
Product Application:
● Memory module, the processor
● Power supply module, integrated chip
● LED lamps, Fever device
Product configuration:
● Bottle 5000g /piece
